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Model Number : Custom
MOQ : 1
Delivery Time : 7-14 days
Quality Control : Package Cavity Measurement, Flatness Inspection, Mounting Hole Verification, Critical Dimension Inspection
Processing : CNC Milling, Cavity Machining, Precision Drilling
Packaging Details : Accept buyer's request for customized packaging
Payment Terms : L/C,D/A,D/P,T/T
Material : PEEK Engineering Polymer or Grade Specified on Drawing
Surface Treatment : Machined Finish, Edge Deburring, Cleaning as Specified
Certification : ISO9001:2015
Brand Name : Shiye
Place of Origin : China
Price : According to the drawings
Tolerance : ±0.01mm
Supply Ability : 10000Pcs/ Month
Application : BGA and QFN Testing, Automated Semiconductor Test Equipment
This custom CNC machined PEEK guide insert is designed for IC test sockets used to position BGA or QFN packages during electrical testing and validation. The package cavity guides the device into position, while the mounting features locate the insert within the socket assembly before electrical contact is made.
PEEK provides a lightweight engineering polymer option with good machinability and dimensional stability. If electrostatic control or specific cleanroom cleanliness is required, the material grade and cleaning requirements must be explicitly specified.
Before production, confirm the package outline, cavity clearance, contact area keep out zones, mounting interface, flatness and replacement requirements. The guide insert must match the socket geometry so that the device seats correctly without interfering with contacts or package edges.

For more custom semiconductor test socket components, explore our IC Test Sockets
For precision cavities and multi face component machining, see our CNC Multi-Axis Machining.
Need a Similar Custom Part?
Have a drawing or CAD file for a similar component? Send us your requirements, material and quantity for a quotation. Request a CNC Machining Quote
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CNC PEEK IC Test Socket Package Guide Insert for BGA Testing Images |